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Understanding the deformation creep and role of intermetallic compound-microstructure in Sn-Ag-Cu solders
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Gu, Tianhong; Xu, Yilun; Britton, Ben; Gourlay, Christopher; Dunne, Fionn — 2024-10-22 The data released here is for the paper "Understanding the deformation creep and role of intermetallic compound-microstructure in Sn-Ag-Cu solders". DOI: 10.1016/j.msea.2024.147429. Tianhong Gu*1,2, Yilun Xu*1.3, Christopher M. Gourlay1, Fionn P.E. Dunne1 and T. Ben Britton1,4 1Department of Materials, Imperial College London, SW7 2AZ, UK.2Department of Civil Engineering and XJTLU Advanced Materials Research Center(AMRC), Xi’an Jiaotong-Liverpool University, Suzhou, Jiangsu, 215123, China.3 Institute of High Performance Computing (IHPC), Agency for Science, Technology andResearch (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632,Republic of Singapore.4Department of Materials Engineering, University of British Columbia, Vancouver,British Columbia, V6T 1Z4, Canada.*Corresponding author: Tianhong.gu@xjtlu.edu.cn; Xu_yilun@ihpc.a-star.edu.sg  The data bundle was prepared by Tianhong Gu https://creativecommons.org/licenses/by/4.0/legalcode

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(Author: Dunne, Fionn)

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